Custom PCB Enclosures & IoT Hardware Packaging
Ruggedized industrial housings in carbon-fiber-reinforced composites and high-impact polymers, paired directly with Pillar A electronics.
One print process takes you from a bespoke commission to a scalable retail line, with no mold to pay for.
Designed, built and documented under a single accountable roof.
On milestone completion the files, source, BOM and publication rights are handed back to you.
- What we deliver
Materials and finishes,
specified up front. - 01
PA-CF, PET-CF composites; ABS, PC high-impact polymers
- 02
Passive cooling fin arrays, vents, tight-tolerance connector cutouts
- 03
USB-C, Ethernet, M12 industrial connectors, external antennas
- 04
Rapid prototyping to low-volume production, no injection-mold tooling
Want this scoped against your project? Tell us what you have and we will map the path.
Scope this with us
Where it lands
on the path to launch.
From a rapid prototype to a low-volume run, with no injection-mold tooling in the way.
- Phase 1
Proof of Concept
Development-board breadboarding, core sensor communication, and logic validation.
Not a focus here - Phase 2
Engineering Validation
Custom PCB layout, miniaturization, 3D enclosure printing, and bare-metal firmware.
This service is active - Phase 3
Design Validation
Fully integrated device delivery, optimized firmware, and diagnostic GUI integration.
This service is active - Phase 4
Launch Readiness
Small-batch fabrication, branding assets, marketplace listing, and compliance readiness.
This service is active
Need parts without a tooling bill?
Print the first run with us.
Share a part, a scan or a product idea. We recommend the material and finish, then quote a run from a single piece to a retail batch.