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Pillar A · Engineering

Custom PCB & Schematic Design

Compact, application-specific PCBs (up to 6 layers) for wearable form factors, constrained biomechanical housings, and low-power battery operation.

Pillar A
Embedded Hardware & Engineering

Off-the-shelf boards fail exactly where research gets interesting. We build hardware that survives the edge cases your data depends on.

Scope
One accountable team

Designed, built and documented under a single accountable roof.

Ownership
Zero lock-in

On milestone completion the files, source, BOM and publication rights are handed back to you.

  • What we deliver

    Every file and board,
    handed back to you.

  • 01

    Schematic capture from a blank sheet

  • 02

    Up to 6-layer multi-layer routing

  • 03

    Miniaturized layouts for wearables and constrained housings

  • 04

    Manufacturing-ready Gerber files: you keep complete design ownership

  • Want this scoped against your project? Tell us what you have and we will map the path.

    Scope this with us
How this fits the lifecycle

Where it lands
on the path to launch.

Breadboard logic becomes a miniaturized board in Phase 2, then a field-ready revision in Phase 3.

  1. Phase 1

    Proof of Concept

    Development-board breadboarding, core sensor communication, and logic validation.

    Not a focus here
  2. Phase 2

    Engineering Validation

    Custom PCB layout, miniaturization, 3D enclosure printing, and bare-metal firmware.

    This service is active
  3. Phase 3

    Design Validation

    Fully integrated device delivery, optimized firmware, and diagnostic GUI integration.

    This service is active
  4. Phase 4

    Launch Readiness

    Small-batch fabrication, branding assets, marketplace listing, and compliance readiness.

    Not a focus here

Have a device in mind?
We will build it from zero.

Describe the sensor, the form factor and the data you need. We scope the board, firmware and enclosure as one engineering path.