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TGIE
Pillar A

Embedded Hardware & Engineering

From research question or product idea to a working, field-ready device: off-the-shelf boards fail at the edges, so we build the full stack from zero and you keep complete design ownership.

Start a ProjectWhat we deliver
The form we give

Working hardware: silicon, firmware, and enclosure.

The weight we lift

Building it from zero.

What we deliver

Everything in this pillar,
under one accountable team.

01

Custom PCB & Schematic Design

Compact, application-specific PCBs (up to 6 layers) for wearable form factors, constrained biomechanical housings, and low-power battery operation.

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02

Mechanical & Ergonomic 3D Enclosures

Custom housings, sensor mounts, and ergonomic enclosures designed concurrently with the PCB footprint, so no board is ever left raw and exposed.

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03

Embedded Firmware Development

Bare-metal and FreeRTOS firmware across Espressif ESP-IDF, Nordic nRF Connect, and STM32CubeMX, engineered for research-grade data integrity.

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04

Edge AI & On‑Device ML (TinyML)

Lightweight neural networks on microcontrollers for movement detection and bio-signal processing: real-time inference at the edge, no cloud dependence.

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05

Full‑Stack Data Visualization

Cross-platform mobile app interfaces and desktop diagnostic dashboards, closing the loop from sensor to actionable data for research and product clients alike.

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06

Small‑Batch R&D Production

The physical build-out of research and pre-production hardware: more than a one-off prototype, lighter than heavy fabrication.

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Have a device in mind?
We will build it from zero.

Describe the sensor, the form factor and the data you need. We scope the board, firmware and enclosure as one engineering path.

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